Angélique Raley

Angelique Raley is a semiconductor professional with 15 years of industry experience in driving memory and logic semiconductor process integration improvements and process technology in plasma etching. She has strong project management skills and is an enthusiastic and energetic team player with excellent communication skills. Angelique specializes in integration, FEOL/BEOL dry etch process development, DOE, data mining/analysis, project management, materials science, multi-patterning, EUV patterning, and marketing. She has worked at Tokyo Electron US as a Manager & Mts, Process Development Engineering, Director, Etch BU, Corporate Marketing, and Nand Flash Feol Process Integration Engineer. Angelique has also interned at Caltech and has experience in research and research.